grinding process silicon

  • Processing of Silicon (Si) DISCO Technology Advancing

    Silicon wafers are made by forming high-purity silicon into a large and narrow ingot and cutting the ingot into disks. There are some manufacturing processes for silicon ingots such as the CZ (Czochralski) method and the FZ (floating zone) method. There are three crystal orientations for silicon (Si) substrates (100) (110) and (111).

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  • Subsurface Damage Detection on Ground Silicon Wafers

     · A silicon wafer is important for the electronic and computer industries. However subsurface damage (SSD) which is detrimental to the performance and lifetime of a silicon chip is easily induced in a silicon wafer during a grinding process since silicon is typically a hard and brittle material.

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  • Process induced sub-surface damage in mechanically ground

     · In the rough grinding process the brittle grinding mechanism which is commonly seen in Si takes place in addition to the ductile grinding. As illustrated in figure 10 when a sharp grit gets into contact with the wafer surface a stress is applied to the silicon. Since the contact region of a sharp grit is rather small the stress surpasses

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  • (PDF) A grinding-based manufacturing method for silicon

    A grinding-based manufacturing method for silicon wafers has been investigated. It has been demonstrated that the site flatness on the ground wafers (except for a few sites at the wafer center)

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  • WAFER EDGE GRINDING PROCESS (Wafer Edge Profiling

     · 1. Challenges in the Edge Grinding process a. Diamond wheelsthe choice of grits bond matrixes concentration etc. b. Uneven grinding c. Uneven wear of the grinding wheel d. Improper angle of the profile e. Edge flaking during grinding f. Edge grinding is a time consuming process

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  • Processing of Silicon (Si) DISCO Technology Advancing

    The surface of the silicon (Si) substrate has minute undulations immediately after being cut out from the silicon ingot into a disk so it is necessary to planarize and thin the silicon (Si) substrate to the designated thickness. For this wafer thinning process DISCO s grinders (processing using a grinding

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  • Process study on large-size silicon wafer grinding by

     · Grinding by use of fixed diamond abrasive stands out as the most promising process technology for large size Si wafering (Okahata et al. 2014). Currently the in-feed grinding scheme as shown in Fig. 1 (a) has been widely adopted in the grinding of Si wafers.

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  • Processing of Silicon (Si) DISCO Technology Advancing

    The surface of the silicon (Si) substrate has minute undulations immediately after being cut out from the silicon ingot into a disk so it is necessary to planarize and thin the silicon (Si) substrate to the designated thickness. For this wafer thinning process DISCO s grinders (processing using a grinding

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  • Investigation of precision grinding process for production

     · The process is purely physical and does not depend on parameters such as the temperature or wafer doping con-centration. Precision grinding of silicon proceeds in two stages coarse grinding followed by fine grinding. During the coarse grinding stage the wafer and grind wheel rotate at 200–250 rpm the removal rate of silicon is about 250

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  • (PDF) Integrated process for silicon wafer thinning

    A low cost and reliable wafer thinning process for Through Silicon Via (TSV) based three dimensional system in packaging (3D SiP) technology is presented. Silicon wafers were first thinned by means

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  • Characterization of ELID grinding process for machining

     · Silicon is widely used as a substrate material in fabricating micro electronic devices. The electrolytic in-process dressing (ELID) grinding process has been found to be an efficient process for machining silicon to generate superior surface qualities.

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  • Grinding wheels for manufacturing of silicon wafers A

     · Grinding is an important process for manufacturing of silicon wafers. The demand for silicon wafers with better quality and lower price presents tremendous challenges for the grinding wheels used in the silicon wafer industry. The stringent requirements for these

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  • Simulation of Back Grinding Process for Silicon Wafers

     · grinding operation of silicon wafers in order to predict residual stresses and achieve a thorough understanding of the plastic deformations and damage processes during a grinding operation. The numerical simulations involve varying grinding parameters to determine optimum conditions that will minimize the residual stresses and surface damage.

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  • Ultraprecision grinding technologies in silicon

     · Pietsch G. J. Kerstan M. Simultaneous double-disk grinding-machining process for flat low damage and material-saving silicon wafer substrate manufacturing. In Proceedings of the 2nd EUSPEN International Conference Turin Italy 27–31 May 2001 pp. 644647. Google Scholar

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  • Process study on large-size silicon wafer grinding by

     · small diameter grinding wheels to grind large size Si wafers as shown in Fig. 1 (b) and the effects of wheel diameter on wafer geometry and surface roughness have particularly been studied. Process study on large-size silicon wafer grinding by using a small-diameter wheel Yutaro EBINA Tomoya YOSHIMATSU Libo ZHOU

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  • (PDF) A grinding-based manufacturing method for silicon

    A grinding-based manufacturing method for silicon wafers has been investigated. It has been demonstrated that the site flatness on the ground wafers (except for a few sites at the wafer center)

    Chat Online
  • Investigation of precision grinding process for production

     · centration. Precision grinding of silicon proceeds in two stages coarse grinding followed by fine grinding. During the coarse grinding stage the wafer and grind wheel rotate at 200–250 rpm the removal rate of silicon is about 250 mm/min and the wafer thickness tolerance is 63 mm. The fine grinding stage provides an improved wafer thickness

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  • Investigation of precision grinding process for production

     · The application of precision grinding for the formation of a silicon diaphragm is investigated. The test structures involved 2–6 mm diam diaphragms with thicknesses in the range of 25–150 ॖm. When grinding is performed without supporting the diaphragm bending occurs due to nonuniform removal of the silicon material over the diaphragm region.

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  • Fine grinding of silicon wafersK-State

     · Fine grinding of silicon wafers requires high predictability and consistency which requires the grinding wheel to possess self-dressing ability i.e. after initial truing the wheel should not need any periodic dressing by external means.

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  • (PDF) Integrated process for silicon wafer thinning

    A low cost and reliable wafer thinning process for Through Silicon Via (TSV) based three dimensional system in packaging (3D SiP) technology is presented. Silicon wafers were first thinned by means

    Estimated Reading Time 5 minsChat Online
  • Subsurface Damage Detection on Ground Silicon Wafers

     · A silicon wafer is important for the electronic and computer industries. However subsurface damage (SSD) which is detrimental to the performance and lifetime of a silicon chip is easily induced in a silicon wafer during a grinding process since silicon is typically a hard and brittle material.

    Chat Online
  • Grinding wheels for manufacturing of silicon wafers A

     · Grinding is an important process for manufacturing of silicon wafers. The demand for silicon wafers with better quality and lower price presents tremendous challenges for the grinding wheels used in the silicon wafer industry. The stringent requirements for these

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  • Generation and distribution of residual stress during nano

    Monocrystalline silicon is the base material in semiconductor industry and grinding is the most widely used technology to process silicon to desired thickness. As the demand of ultra-thin silicon die in electronic industry grinding induced residual stress will cause server wafer warpage.1) As the

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  • Ultraprecision grinding technologies in silicon

     · Pietsch G. J. Kerstan M. Simultaneous double-disk grinding-machining process for flat low damage and material-saving silicon wafer substrate manufacturing. In Proceedings of the 2nd EUSPEN International Conference Turin Italy 27–31 May 2001 pp. 644647. Google Scholar

    Chat Online
  • Process induced sub-surface damage in mechanically ground

     · In the rough grinding process the brittle grinding mechanism which is commonly seen in Si takes place in addition to the ductile grinding. As illustrated in figure 10 when a sharp grit gets into contact with the wafer surface a stress is applied to the silicon. Since the contact region of a sharp grit is rather small the stress surpasses the fracture strength of silicon.

    Chat Online
  • Process study on large-size silicon wafer grinding by

     · Grinding by use of fixed diamond abrasive stands out as the most promising process technology for large size Si wafering (Okahata et al. 2014). Currently the in-feed grinding scheme as shown in Fig. 1 (a) has been widely adopted in the grinding of Si wafers.

    Chat Online
  • Semiconductor Back-Grindingidc-online

     · Semiconductor Back-Grinding The silicon wafer on which the active elements are created is a thin circular disc typically 150mm or 200mm in diameter. During diffusion and similar processes the wafer may become bowed but wafers for assembly are

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